2018 Int'l pMEMs Workshop

2018 Int'l pMEMs Workshop

PiezoMEMS Foundry to Support Research Projects Naomi Montross, Joe Evans, Gerald Salazar, Spencer Smith, Bob Howard, Radiant Technologies, Inc. 2019 International Workshop on Acoustic Transduction Materials and Devices May 7, 2018 Advanced Systems Test Radiant Technologies, Inc. Radiant Technologies has completed the first test wafer of its I-Beam piezoMEMS process. Radiant will accept capacitor or piezoMEMS foundry projects from universities and organizations to run on this process. Advanced Systems Test Radiant Technologies, Inc. Introduction Objective of the I-Beam Process Description of the Process

Example Devices Project Flow Contact Info Advanced Systems Test Radiant Technologies, Inc. Objective of the Foundry Service Shift the focus from the complexity of piezoMEMS fabrication to more important issues associated with device design and performance . Reduce the time and cost to complete the fabrication of piezoMEMS or integrated capacitor designs. Generate higher yield to increase the population of functional devices available in a project. Provide a path to physically plug piezoMEMS and integrated capacitor circuits directly into analog or digital control circuits. Advanced Systems Test Radiant Technologies, Inc. Overview of Process Flow The three fundamental steps of the process flow: Fabricate the solid state capacitors atop the wafer.

Deposit the metallic I-Beams above the capacitors and pattern them into the geometry of the final mechanical structures. Execute a single through-wafer DRIE step to remove all silicon from beneath the I-Beams. The process utilizes thick metal layers above the actuator and sensor capacitors to create robust structures. Advanced Systems Test Radiant Technologies, Inc. Process Flow Start with thin PZT Capacitors Deposit I-Beam Simple Repeatable Robust Affordable Fast High Yield Execute backside DRIE etch

Advanced Systems Test Radiant Technologies, Inc. From Layoutto Device Through-wafer hole Cantilever Advanced Systems Test Radiant Technologies, Inc. to Test Etched backside well seen through transparent PZT/SiO2 layers. PZT Membrane Capacitor Electrodes [ 400um x 250um ] Proc. Hyst Proc. Disp

30 C/cm2 20 10 0 -10 -20 -30 2.0 PZT 1.5 Thirty second loop of 1m 4/20/80 PNbZT measured with AFM. Microns 1.0 0.5 0

-0.5 -1.0 -1.5 -20 -15 -10 -5 0 Volts 5 10 15 20 Calibrated. Error = 1.13m/V x 0.1Vpp = 0.11m Advanced Systems Test Radiant Technologies, Inc.

to Package If the die is 1.7 millimeters on a side or smaller, it will fit in a TO-18 transistor can. If the die is larger than 1.7mm, Chrome/Copper/Gold solder pads on the die allow soldering directly to printed circuit boards. Radiant uses an SOIC format on a 3.4mm x 3.4mm die floor plan Advanced Systems Test Radiant Technologies, Inc. Solid State Module Exploded view of a Radiant integrated PZT capacitor. MIRROR BE VIA TE VIA ILD M1

PZT Passivation Electrodes FE Thermal Silicon Dioxide Substrate Advanced Systems Test Patterned BE FE overlap of BE Edge Combine PZT/Glass passivation for reliability. Radiant Technologies, Inc. Advantages of Radiants Capacitor Stack ILD allows non-circuit metal layers to be positioned above the capacitor.

ILD Passivation improves reliability and capacitor survivability in post processing. Ferroelectric material overlap of BE edge prevents TDDB arising from etch damage at the ferroelectric boundary. Mirror, I-Beam, Sensor M1 ILD FE Silicon substrate Advanced Systems Test Patterned Bottom Electrode provides more flexible device design. Radiant Technologies, Inc. Uniformity & Yield

No shorts out of 64 capacitors across two wafers. 1m-thick - 100,000m2 - 4/20/80 PNbZT - Platinum electrodes Hysteresis Sort after Completion [ CAC-1304 Wafers 2 & 4 - AC104 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1

W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1

W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W2 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1

W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1

W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1

W4 Sort: Polarization (C/cm2): 1 W4 Sort: Polarization (C/cm2): 1 30 20 uC/cm2 10 0 -10 -20 -30 -20 Advanced Systems Test -15 -10 -5 0

Volts 5 10 15 20 Radiant Technologies, Inc. Example Device Membrane with Center Mass Backside Advanced Systems Test Radiant Technologies, Inc. Example Device Dual Strings Backside Advanced Systems Test

Radiant Technologies, Inc. Example Device Tuning Fork Advanced Systems Test Radiant Technologies, Inc. Example Devices Advanced Systems Test Radiant Technologies, Inc. Project Flow Radiant provides a GDS II file of the STARTW project. STARTW includes the wafer boundaries, alignment marks, and an assortment of design-rule-compliant cells such as vias, capacitors, solder pads, etc. that are building blocks for larger structures. Customer executes design.

Radiant conducts a final design review of the project, acquires masks and fabricates the wafers. Finished dice are be submitted to the researcher. Radiant advises on testing. Advanced Systems Test Radiant Technologies, Inc. StartW Wafer 4 Wafer Boundary Alignment Marks Cell Library

Advanced Systems Test Radiant Technologies, Inc. Contact Please contact Naomi Montross or Joe Evans at Radiant Technologies in Albuquerque. +1-505-842-8007 [email protected] *** Put Foundry in the Subject Line to route it to Radiants clean room. This PowerPoint file will be on-line at www.FerroFoundry.com Advanced Systems Test Radiant Technologies, Inc.

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